PCB Ɔhyew Lamination Buffer Pad

Sanpu Silicone Sponge Pad no fã bi:

1.High Temperature Resistance & Thermal Stability Properties:Non -powdering na no hardening akyi mpɛn pii a ɛkorɔn - ɔhyew lamination

2.Low Contamination & Nneɛma a Atwa Yɛn Ho Ahyia Friendly:Pass RoHS ne FDA

3.Closed-Cell Structure:Wɔ lamination nhyehyɛe no mu no, nsuo a ɛyɛ hyew a boards no gyae no rennye na ɛbɛtumi ayi afiri mu yie, na ɛtew sintɔ te sɛ bubbles, white spots ne delamination so.

4.Chemical stability: Ɛnnyɛ adwuma ne epoxy resin anaa PP prepreg resin na ɛrensɛe kɔbere foil.

Mfaso a ɛwɔ Silicone Sponge so Sɛ PCB ɔhyew lamination buffer pad

1. Honam fam ahoɔden a ɛkyɛn so de tua kɔbere mu duru nsonsonoe ne board a ɛnyɛ pɛ no ka
2. Nhyɛso kyekyɛ a ɛyɛ pɛ, delamination kakraa bi, void, kɔbere indentation sintɔ ahorow
3. Ɔhyew a ɛkorɔn a ɛko tia ne ɔhyew adwumayɛ a ɛyɛ den
4. Closed-cell nhyehyɛe ma nsu pa a wɔde fi mu
5. Sulfur a ɛba fam & volatiles a ɛba fam, efĩ a ɛba fam, nneɛma a wɔyɛ a ɛho tew
6. Reusable, tear-resistant, trɛw a ɛne ne ho hyia ma HDI, kɔbere a emu yɛ duru, anammɔn PCB

Paw Sanpu Silicone a ɛwɔ hɔ

1.Yɛyɛ mfitiase silicone sponge supplier

2.Yɛwɔ bɛboro mfe 16 osuahu a ɛfa silicone sponge a wɔyɛ ho

3.Mandatory nhwehwɛmu ansa na woafi adwumayɛbea,quality nhwehwɛmu amanneɛbɔ no abata ho

4.Free nhwɛsode, di yɛn ho nkɔmmɔ na woanya free nhwɛsode