Sɛ nkwaa a ɛka bom no di nkogu a, mpɛn pii no, yɛn anammɔn a edi kan no hwehwɛ sɛ yɛhwɛ sɛ ebia ahoɔden a wɔde bata ho no fata, sɛnea wɔde aduru a ɛwɔ soro no yɛ no yiye, nsu a wɔde ahyɛ mu no dɔɔso, na nneɛma no nnyinii anaa.
Nanso, wɔ mfiridwuma ho dwumadie ankasa mu no, huammɔdi ahorow bi mfi ase bere a wɔahyɛ sɛ wɔmfa nni dwuma nkutoo; mmom no, asiane ahorow a ebetumi aba no wɔ hɔ dedaw bere a ade a wɔde nkata so no ayɛ yiye koraa no.
Saa asiane a ebetumi aba yi ne emu nhyɛso a aka a ɛwɔ hɔ.
Ɛyɛ nea wontumi nhu na ɛyɛ den sɛ wobesusuw no pɛpɛɛpɛ, nanso ɛnyɛ ahintasɛm wɔ ne su mu. Sɛ yɛbɛka no tiawa a, ade a wɔde nkata ade so no twetwe bere a ɛresa na ɛredwo no; sɛ substrate a atwa ho ahyia no siw ne free deformation ano a, ɔfã a entumi ntew no bɛyɛ residual stress wɔ adhesive layer no mu.
Ɛnnɛ, mɛkyerɛ mo nyinaa kwan wɔ saa adwene yi nteaseɛ mu yie.
0 1 Dɛn nti na sua?
Asiane a ɛwɔ nhyɛsoɔ a ɛwɔ mu no yɛ "ahoɔden-akoraeɛ" su.
Sɛ ɛyɛ den a, ade a wɔde nkata so no sie ahoɔden a ɛtwetwe ahoɔden a ɛyɛ den no fã bi. Saa ahoɔden yi yɛ tumi a ɛkanyan akyiri ma interfacial delamination, microcrack propagation, ne warping deformation.
Fa interface delamination ne delamination sɛ nhwɛsoɔ: emu nhyɛsoɔ boaboa ano wɔ adwumayɛ adesoa no atifi, na ɛma interface nhyɛsoɔ ankasa boro design-bu akontaa rating value no so koraa. Ɔkwan foforo so no, ansa na adhesive layer no befi ase ayɛ ɔsom adwuma wɔ ɔkwan a ɛfata so mpo no, wɔde interface no ahyɛ pre-tensioning a ɛboro so dedaw.
Nhwɛso foforo ne accuracy drift, a ɛda adi sɛ ɛsɛe nneɛma a wɔyɛ no pɛpɛɛpɛ te sɛ robɔt, mfiri, ne nneɛma a wɔde hwɛ ade titiriw.
Magnetic core no gyinabea wɔ motor no mu, optical components a ɛne ne ho hyia, ne structure parts no nsusuwii nyinaa betumi afa bere tenten-drift mu esiane sɛ emu nhyɛso ahorow no gyae nkakrankakra nti. Sɛ mfiase no nneɛma a ɛwom no hyia bere a wɔreboaboa ano nanso ɛda sɛnea ɛtwetwe wɔn ho adi wɔ nnɔnhwerew ɔhaha pii a wɔde ayɛ adwuma akyi a, nsɛm a ɛtete saa taa fi nhyɛso a ɛwɔ mu no mu.
Bio nso, ɔbrɛ nkwa nna so tew. Adwennwen a ɛwɔ mu no gyina hɔ ma bere tenten-adwennwen dodow a ɛyɛ nkyɛmu a sɛ wɔka bom a, ɛbrɛ ɔbrɛ asetra kwan no ase. Ɔhyew a ɛkyinkyini, ɔhyew, ne wosow a wɔaka abom no taa de tebea horow a nneɛma no twa sɔhwɛ a edi kan mu nanso entumi nyɛ adwuma bere a wɔreyɛ no pii no ba.
Enti, emu adwennwen nyɛ asɛm a ɛto so abien na mmom ɛyɛ ade titiriw a ɛsɛ sɛ wodi kan yɛ ansa na wɔatumi de ho ato bonding so. Ɛnyɛ sɛ ebia nea ɛbata ho no betumi aba nko na ɛkyerɛ, na mmom bere tenten a nkitahodi no kɔ so gyina hɔ pintinn wɔ ɛno akyi nso.
0 2 Ɛhe na emu nhyɛso fi ase?
Sɛ obi bɛte adwennwen a ɛwɔ ne mu ase a, ɛsɛ sɛ odi kan te ne mfiase ase.
Adwennwen a ɛwɔ mu bere a wɔde ntama ayɛ no fi ntini ahorow abien a ɛda su a ɛne sɛ ɛbɛtwetwe nanso entumi nyɛ saa ankasa no mu titiriw.
Ɔfã a edi kan ne aduru a wɔde sa shrinkage, a wɔsan frɛ no nnuru shrinkage.
Wɔ nsu monomers mu no, molecule ahorow nam van der Waals tumi ahorow (nkitahodi a ɛyɛ mmerɛw) so kɔ so di nkitaho. Nnuru biara nni molecule abien no atɔm ntam; wɔte hɔ a ɛbɛn hɔ ara kwa, a ɔkwan a wɔtaa fa so no bɛyɛ 0.3–0.4 nm (a egyina hɔ ma van der Waals radii a ɛwɔ molecule abien no nyinaa mu no nyinaa).
Wɔ polymerization adeyɛ no mu no, covalent nkitahodi ahorow ba monomers ntam. Sɛ yɛfa C–C nkitahodi biako a ɛtaa ba sɛ nhwɛso a, ne nkitahodi tenten bɛyɛ 0.154 nm. Wei kyerɛ sɛ mprempren wɔde ahoɔden de covalent bond a ne tenten bɛyɛ 0.15 nm-ka molecule abien a mfiase no na ɛda ntam kwan a ɛyɛ mmerɛw a ɛyɛ bɛyɛ 0.35 nm ntam no bom a ɛde molecule ahorow ntam kwan no so tew bɛboro fã. (Yɛbea)
Wɔ macroscopic level no, molecule abien a ɛte saa ɔpepepem pii a ɛtwetwe bere koro mu no da adi sɛ volume a ɛso tew. Eyi yɛ honam fam ade a efi mu ba a wontumi nkwati koraa wɔ addition polymerization reaction biara mu.
Ɔfã a ɛto so abien ne thermal mismatch stress.
Nnuru pii a wɔde nkata ade so no hia sɛ wɔma ɛyɛ hyew na ama ayɛ yiye. Bere a wɔayɛ no aduru akyi no, sɛ wɔma ɛyɛ nwini fi ɔhyew a ɛkɔ soro mu kɔ dan mu hyew mu a, ɛsono ɔhyew ntrɛwmu nsusuwii a ɛwɔ ade a wɔde nkata so ne nea ɛwɔ ase no mu.
Mpɛn pii no, ɔhyew ntrɛwmu nsusuwii a ɛwɔ ade a wɔde nkata so no mu no korɔn kɛse sen nea ɛwɔ nneɛma a wɔde gyina so te sɛ dade, magnet, ne dɔte mu. Bere a ɛyɛ nwini no, ade a wɔde nkata so no taa twetwe kɔ akyiri, nanso ade a wɔde gyina so no siw ne twetwe a ɛnyɛ hwee ano, na ɛnam so siw ade a wɔde nkata so no ano na ɛma emu nhyɛso a aka no ba.
Adwene a ɛho hia sen biara wɔ ha ne gel point no.
Ansa na gel no bɛkɔ so no, ade a wɔde nkata so no kɔ so yɛ nsu na etumi sen. Wɔ saa bere yi mu no, sɛ twetwe mpo a, ade no betumi asɛe deformation a ɛte saa denam nsu a ɛsen, nhyehyɛe foforo, ne nea ɛhyɛ mu ma so, na ɛnam so ama nhyɛso a ɛboaboa ano wɔ mu no so atew.
Wɔ gel point no akyi no, tebea no sesa. Ntrɛwmu a ɛwɔ afã abiɛsa-fi ase yɛ wɔ ade a wɔde nkata so no mu, na ade no dannan nkakrankakra fi nsu mu kɔ tebea a ɛyɛ den mu. Saa bere yi, adhesive layer no nya adesoa-soa tumi na efi ase "kae" akyiri yi shrinkage ne deformation nsɛm.
Ɔkwan foforo so no, ɔfã a ɛtwetwe a ɛba wɔ gel point no akyi no taa de emu nhyɛso ba ankasa.
Bere kɔ so no, ade no mu yɛ den bio, na ne Tg kɔ soro bere nyinaa. Sɛ Tg no boro mprempren ɔhyew a wɔde yɛ adwuma no so a, ade a wɔde nkata so no dan fi tebea a ɛte sɛ rɔba mu kɔ tebea a ɛte sɛ ahwehwɛ mu.
Sɛ wohyɛn ahwehwɛ tebea no mu a, modulus a ɛwɔ adhesive layer no mu no kɔ soro ntɛmntɛm, na ɛma nkɔnsɔnkɔnsɔn no fã a ɛbɛkɔ no yɛ den kɛse; ne saa nti, adwennwen a kan no na wobetumi ayi afi hɔ no fã bi bɛyɛ den kɛse mpo sɛ wobeyi afi hɔ.
Enti, yebetumi ate adwennwen a ɛwɔ nipadua no mu ase kɛkɛ sɛ:
Ansa na gel point no: contraction betumi aba a ɛremma adwennwen mma ntɛm.
Gel point no akyi: gel layer no fi ase yɛ network, na wosiw shrinkage a edi hɔ no ano.
Wɔ vitrification akyi: ade no yɛ den, na ne molecule nkɔnsɔnkɔnsɔn no ntumi nkɔ baabiara, na ɛma adwennwen a ɛbɛma ayɛ den kɛse.
Sɛnea yɛn nyinaa nim no:
Adwennwen=Modulus × Nhyɛso
Adwennwen a etwa to a ɛwɔ mu ≈ modulus a etu mpɔn × (post-gelation curing shrinkage + thermal mismatch deformation) − ahomegye a wɔayi no adi
Yebetumi ate ɔhyew a ɛnhyia deformation ase kɛkɛ sɛ:
Ɔhyew a ɛnhyia deformation ≈ (ɔhyew ntrɛwmu nsusuwii a ɛwɔ adhesive − ɔhyew ntrɛwmu nsusuwii a ɛwɔ substrate no mu) × ɔhyew nsonsonoe a etu mpɔn
Ntwitwiridii ne ɔhyew a ɛnhyia a ɛba wɔ gel point no akyi nkutoo, a wɔde modulus a ɛkɔ so kɔ soro no dɔɔso, a wɔayi ɔfã a ɛnam ahomegye so gyae bere a wɔreyɛ adwuma no afi mu no nkutoo na ɛyɛ net emu nhyɛso a etwa to.
Eyi nso ne nea enti a ɛyɛ den sɛ wobesua adwennwen a ɛwɔ nipadua no mu ho ade: ɛnsɔre mpofirim prɛko pɛ na mmom ɛboaboa ano nkakrankakra bere a wɔreyɛ ayaresa ne onwini no. Wɔ saa adeyɛ yi nyinaa mu no, nsakrae a ɛkɔ so wɔ sɛnea nneɛma no tew, ɔhyew, modulus, ne tumi a ade no tumi gyae adwennwen no nyinaa kɔ so.
03 Sɛnea wɔkyerɛ su: Di kan susuw "nea efi mu ba," afei susuw "nea ɛde ba."
Mprempren wogye tom kɛse sɛ emu adwennwen mma mpofirim prɛko pɛ, na mmom ɛboaboa ano nkakrankakra bere a wɔreyɛ ayaresa ne onwini no.
Parameter biara a ɛwɔ ha no sesa bere nyinaa: contraction rate, temperature, modulus, ne mpo tumi a ade no tumi gyae adwennwen nyinaa gu ahorow.
Enti, nhyɛso a ɛwɔ mu no su ntumi mfa ne ho nto akontaabu bo biako pɛ so; ɛsɛ sɛ edi nsɛmmisa abien ho dwuma bere koro mu:
Nea edi kan no, adwennwen anaa nsakrae bɛn na ɛda so ara wɔ awiei?
Nea ɛto so abien no, ɔkwan bɛn so na saa nhyɛso ahorow yi ba bere a wɔresa yare no?
Sɛ ɛba akwan a wɔfa so sɔ hwɛ so a, mpɛn pii no wobetumi akyekyɛ mu akuw abien.
Ɔfã biako fa adwennwen anaa deformation aba no susuw tẽẽ ho, bere a foforo no susuw nneɛma mu nsusuwii ahorow de si nhwɛso ahorow so.
Ɔfã 1: Adwennwen anaa deformation a efi mu ba no susuw tẽẽ
Saa kwan yi twe adwene si sɛnea wobehu baabi a deformation anaa residual stress a ɛba wɔ structure no mu no kodu bere a adhesive no ayɛ yiye akyi.
Ɔkwan a wɔfa so yɛ no tete sen biara ne cantilever beam anaa bimaterial beam bending kwan. Wɔde ade a wɔde nkata so gu dade a ɛyɛ tratraa, silicon wafers, anaa nneɛma afoforo a wɔde hyɛ ase so; bere a wɔresa no yare no, adhesive shrinkage ma substrate no kotow. Ɛdenam curvature a wɔsusuw wɔ bere ankasa mu na wɔde ɔkwan a ɛne Stoney nsɛso di nsɛ di dwuma so no, wobetumi abu nhyɛso a ɛwɔ adhesive layer no mu no ho akontaa. Saa kwan yi ma mfaso a ɛwɔ so sɛ ɛyɛ nea wotumi te ase na wɔde asi hɔ yiye, na ɛma wotumi yɛ curves a ɛkyerɛ sɛnea adwennwen gu ahorow bere a wɔde sa yare no ho mfonini wɔ wɔn adwene mu.
Afei nso, fiber Bragg grating (FBG) kwan a wɔfa so yɛ no wɔ hɔ. Ɛdenam optical fibers a wɔde bɛhyɛ gel layer mu so no, wobetumi asusuw nhyɛso a ɛwɔ gel no mu wɔ bere ankasa mu. Saa kwan yi ma wotumi da gel no mu tebea adi pɛpɛɛpɛ bere a wɔde toto ɔfasu no so deformation susuw nkutoo ho no, ɛwom sɛ ɛhwehwɛ sɛ wɔbɔ ka kɛse na ɛyɛ den kɛse wɔ adwumayɛ mu de.
Cure nhyɛso hwɛ wɔ composite laminates denam distributed optical sensor (Mfonini fibea) .
Wɔ adhesives a ɛyɛ mmerɛw ho no, wobetumi nso de photoelasticity anaa birefringence akwan adi dwuma de ahwɛ adwennwen kyekyɛ denam stress-induced birefringence so.
Bio nso, wobetumi de akwan te sɛ drilling, core sampling, X-ray diffraction (XRD), neutron scattering, ne Raman shift analysis nso adi dwuma wɔ tebea pɔtee bi mu de asusuw residual stress anaasɛ indirect strain.